MSAP Flash Etching chemical
1. Application
This potion is a fast etching solution for hydrogen peroxide / sulfuric acid system developed for the fine line forming technology of MSAP. The main application is to deal with the formation of Min L/S=20um/20um line with MSAP process.
2. Technical advantages
It can prevent the side erosion from getting the ideal line shape.
It can inhibit lateral erosion of lines and get wider line width.
Fine pattern for L/S=20/20.
The solution is easy to manage hydrogen peroxide / sulfuric acid etching solution.
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